Qualcomm has recently partnered up with Samsung to launch the next-generation processor, Snapdragon 835, a 10-nanometer chipset that will be found in upcoming Android smartphones.
According to IT Pro, the chips are created using Samsung’s 10nm 10LPE FinFET manufacturing process that allows more features to be squeezed into the device despite the size, deemed to be as small as a single water molecule or only a fraction of a human hair. The chip also offers the power and strength better than its larger counterparts.
Specifically, Snapdragon 835 is 30 percent reduced in size, 27 percent improved in performance and makes use of 40 percent less power than the current Snapdragon 821 processor.
In a statement, Qualcomm’s senior vice president of product management Keith Kressin shared their excitement over the collaboration.
“We are excited to continue working together with Samsung in developing products that lead the mobile industry. Using the new 10nm process node is expected to allow our premium tier Snapdragon 835 processor to deliver greater power efficiency and increase performance while also allowing us to add a number of new capabilities that can improve the user experience of tomorrow’s mobile devices,” he said.
Devices that will utilize the system-on-chip will also be able to take advantage of Quick Charge 4 technology which delivers high voltage and current to speed up the time to ramp up the battery. It is expected to recharge the battery faster than Snapdragon 821’s Quick Charge 3 that is apparently capable of up to 80 percent in about 15 minutes in the case of Google’s Pixel XL.
Quick Charge 4 will reportedly enable a 20 percent faster charging rate, giving smartphones up to five or more hours of use with just five minutes of being plugged in. It will also integrate USB-PD and USB Type-C support.
Snapdragon 835 is expected to ship with commercial devices sometime during the first half of 2017.