MediaTek recently announced their newest flagship chipset on the market the Helio X30. The successor to the current Helio X20 also boasts of a deca-core processor, but this time it works in a more efficient way and carries with it more powerful cores, thereby promising better performance than its predecessor.
The Helio X30 is the first chipset from the company to be built under the thinnest and smallest architecture ever for a MediaTek chipset the premium 10 nm FinFET process. The previous Helio X20 was built under the 20 nm FinFET process, while most other Android smartphones are currently running on chipsets made from 16 to 14 nm FinFET architecture.
The new Helio X30 follows on what the Helio X20 began having a deca-core chipset. But this time, the same number of cores comes in as more powerful as the developer was able to squeeze in a more capable set of cores that would be bringing in better performance with enhanced processing power.
More specifically, there are four “big” octa-core Cortex A-73 cores clocking in at 2.8 GHz. Next comes four “little” Cortex A-53 cores that run at 2.2 GHz. Lastly, there are two extra cores, the dual-core Cortex A-35, that serve as a power-saving layer.
As for the graphics, the new chipset would be using a quad-core PowerVR 7XT graphics processing unit (GPU), the same one that is currently used by the latest generation iPads and iPhones. The GPU will handle graphics and video playback.
The chipset can manage to work with up to 8 GB worth of random access memory (RAM), a fast Universal Flash Storage (UFS) 2.1, and a dual-camera setup with up to 26 megapixels. As for internet speeds, the chipset supports the LTE Cat. 12 modem.
The first batch of devices running on the Helio X30 is expected to arrive sometime in July 2017.