For several months now, the specifications and features of Apple’s iPhone 7 have been in the rumor mill as fans look forward for the company’s next flagship.
Mac Otakara, a Japanese writer who summed up the theorized features of the iPhone 7 on his blog, indicated that the upcoming handset will be the same as the iPhone 6 in terms of height, but it will be one-millimeter thinner than its predecessor because of the thinner LCD, reported Apple Insider. The thinner device may also attributed to the rumored removal of the 3.5mm phone jack that enables the device to have a lightning port.
Aside from this, there are also rumors that the upcoming device will remove the antenna at the back of the smartphone, thus eliminating the “camera bump” that was seen in prvious iPhone 6 lines. The device is also anticipated to have a stereo speaker as well as a flush rear snapper and dual-lens camera system that may enhance the quality of the photo output.
On the other hand, there are also theories that were proven to be false in the same report. For instance, the iPhone 7 was initially forecasted to improve its waterproof features by using a different element or material. However, the same report said that this will not happen, as the upcoming device will keep its current metal chassis design and waterproof capability.
Moreover, Taiwan Semiconductor Manufacturing Company (TSMC) is said to be the one working on the iPhone 7’s processor, referred to as the A10 chip. With this, the device is expected to be faster.
The iPhone 7, along with an iPhone 7 Plus, are expected to be announced in the company’s event in September. In the meantime, another event will be held in March that is expected to release the iPhone 5se, a new iPad, and the MacBook 2016.