Latest reports about the upcoming iPhone 7 suggest that the absence of the 3.5 mm headphone jack is not only the only big change in the smartphone. A report by the Electronic Times revealed that Apple recently inked a deal with Taiwan Semiconductor Manufacturing Company (TSMC) regarding the manufacturing of the company’s future main chip set, the A10 processor.
The contract effectively makes TSMC the sole company responsible for making the aforementioned chipset. Samsung, on the other hand, who has long been a part of the process, is also said to have been totally taken out of picture.
Apple and TSMC’s relationship is not a new one as the latter produced the A8 chip powering the tech giant’s latest releases which included the iPhone 6 and iPhone 6 Plus. However, at this time, Samsung was still on board with the production of the A9 chip which was then used for iPhone 6s and iPhone 6s Plus. This, however, drew a bit of controversy as users noticed the difference between the 6 and 6s line in terms of performance. Based on Benchmark tests conducted for the iPhone 6s model with the TSMC-produced chip, it ran cooler and had a better battery life compared to the iPhone models using the Samsung-made chip.
The report further detailed that the Cupertino-based company chose to seal the deal with TSMC because they were more than impressed with its 10-nanometer manufacturing process. Backing this up is an article published by China Times revealing that Apple was mainly interested with a partnership with TSMC because their procedure is more cost-effective compared to how Samsung is doing it. With this, Apple is already looking to expand their partnership with the Taiwanese company with Apple eyeing the company’s InFO (Integrated Fan Out) design, which would pave the way for making smaller and lighter chips.
TSMC is expected to go into production of the A10 sometime in June as the iPhone 7 is speculated to be launched in September.