Huawei Honor 7 rumors, specs: new leak shows device and its major hardware specs


The Huawei Honor 7 Plus, the long rumored upsized version of the hit smartphone Huawei Honor 7, is once more hot on the rumor mill as full image renders along with details on its major hardware specifications have leaked, all thanks to the famous online mobile phone leaker Steve Hemmerstoffer.

As posted the leaker (@OnLeaks on Twitter), the image render showed the alleged Huawei Honor 7 Plus, with one of the most significant highlights being the trademark fingerprint scanner on the back of the phone. The leaker even had a video version of the full 360-degrees view of the smartphone.

Additionally, OnLeaks also revealed some specs of the upcoming smartphone. It may come with a 5.5-inch wide display with a 1080p Full HD resolution, and come 151.4 mm tall, 76.3 mm wide, and at only 7.9 mm thin.

If other specs would not differ from the original Honor 7, then the device can be expected to run under a HiSilicon Kirin 935 chipset with a quad-core Cortex A53 CPU, along with a Mali-T628 MP4 GPU. 3 GB worth of RAM may be available, along with variant of either 16 GB or 64 GB worth of built-in internal memory, with support for an external microSD expansion using the SIM2 slot of the phone.

No release date for the Huawei Honor 7 Plus was hinted of as of the moment.

In other news, a tip came from Chinese website Weibo, as reported by Mobipicker, and it points out that Chinese mobile company Huawei may be venturing into the dual-curve display business, as they are rumored to be releasing a dual-curved smartphone that is “2K” on all sides. This presumably means that the device will be having a Super AMOLED display with Quad HD (2K resolution) 2560 x 1440 resolution.

The report claimed that Huawei is planning to ship 3 million of the panel design a month.

Should this rumor prove to be true, this will be Huawei’s first take on a dual-curved display smartphone, as well as its first take on a Super AMOLED Display with a Quad HD resolution.